AMC Co., Ltd.

Established in 1996, AMC Co., Ltd. has been manufacturing and supplying the tape for semiconductor companies all over the world. Our main product is semiconductor tape used in processing the Semiconductorsnductor wafer for backgrinding and dicing

COMPANY OUTLINE

Company Name AMC Co., Ltd
President Ahn Yong-Kook
Established July 27, 1996
Address #497 Docheong-ri, Geumwang-eup, Eumseong-gun, Chungbuk, Korea Post Code; 369-901
Homepage http://www.amc11.com/
Products UV type & non-UV type Tape for Wafer Back Grind
UV type & non-UV type Tape for Dicing for wafer, Package Dicing Dicing Die Attach Film (DDAF, WBL Tape)
Sapphire Polishing Slurry, Wafer Polishing Slurry
Main Export Nation U.S.A , China, Taiwan, Belarus, Malaysia, Singapore

COMPANY HISTORY

2010 ~ The present 2015 : Registered patent for DDAF with suppressed generation of cutting chips
2014 : Registered patent for photosensitive film
2014 : Selected as an "Enterprise allocated expert researcher" 2013 : Developed "Smart skin scanner" for smart phone
2013 : Advanced into chemical market(CMP slurry and OLED material) 2011 : Company name change (AMC CO.,LTD)
2011 : Site-Movement (Eumseong-gun, Chungbuk, Korea)
2000 ~ 2009 2009 : Kyonggi-Do small and medium enterprise objective emplacement
2009 : Award for Enterprise of Practicing New Technology (Minister of Knowledge Economy) 2005 : KT[Excellent Korean Technology] by MOST
2003 : INNO-BIZ Certification by SMBA
2003 : Venture Company Certification by SMBA
2003 : Set-up R & D Center
2003 : ISO 9001 Certification by KFQ
2003 : Registered Specialized in Material & Component Company by MOCIE 2003 : Clean Plant by MOLAB
Established 1998 : Developed the Tape for Dicing, Back grinding
1996 : Registered as ACE Industries Co., Ltd.

TAPE DIVISION

Back Grind Tape
  • Improving TTV Value
  • Prevent Dust and Wafer Penetration
  • Absorbing Mechanical stress
    • Dicing Tape
  • UV curing type Wafer Dicing tape
  • Expandable type
  • Improved back side chipping, contamination
    • Package Dicing Tape
  • UV curing type Package Dicing tape
  • Improved back side chipping, contamination
  • Higher Adhesive tape for Package Dicing
    • Die Attach Tape (DAF Tape, WBL)
  • Wafer Dicing and bonding
  • UV curing type
  • Thermal curing type, high adhesive strength

    • CHEMICAL DIVISION

    Hard material Polishing Slurry
  • Ecosil®series : Hard material Polishing Slurry
  • High purity colloidal silica
  • Provide a polished surface with a high degree of efficiency
  • Individual, non-setting spherical particles
    • Silicon Wafer Polishing Slurry
  • Ecosil®WP series : Silicon Wafer Polishing Slurry
  • Provide a polished surface with a high degree of efficiency
  • Non-agglomerating slurries with tight particle distributions
  • Individual, non-setting spherical particles
    • High Performance Detergent
  • SC series : Detergent for glass & aluminium material
  • Enables long bath lifetime at low concentrations.
  • Effectively removes polishing compounds
  • No damage to aluminum materials.
    • Protective Coating Agent for Laser Saw
  • Less hardening when laser sawing
  • Excellent leveling
  • Defect decreases due to high UV transmittance of the coating layer
    • Adhesive for Polishing of Sapphire Wafer
  • SPA series : Adhesive for Polishing of Sapphire Wafer
  • High softening point and excellent heat resistance
  • No adhesion due to high adhesive strength
  • Excellent spin coating property